Senior PCB Design Engineer

The Role:
We are seeking a Senior PCB Design Engineer with strong EDA library ownership and advanced high-speed board design experience to drive the implementation of our next-generation data center accelerator platforms.

In this role, you will be responsible for the complete PCB design process, from library definition and design rules, through floorplanning, routing, and tape-out, while collaborating closely with Signal Integrity (SI) and Power Integrity (PI) experts to define layer stacks, PDN strategies, and constraints.

This is a hands-on, technically demanding role focused on very high-density, high-layer-count boards, pushing the limits of power delivery, memory integration, and high-speed interfaces, using Siemens Xpedition as the primary design environment.

Key Responsibilities:

• Design and layout complex, high-layer-count PCBs for accelerator and data center platforms.
• Own and maintain EDA libraries (symbols, footprints, padstacks, constraints).
• Define routing constraints and complex design rules for high-speed and high-power designs.
• Collaborate with SI/PI teams on layer stack-ups, impedance control, and PDN design.
• Collaborate with mechanical and thermal experts to ensure design integration.
• Drive designs from concept through tape-out, including manufacturing deliverables.
• Support DFM reviews, board bring-up, and hardware debug activities.

Required Qualifications:

• Bachelor’s and Master’s degree in Electrical Engineering or related field.
• 5+ years of hands-on PCB layout experience in complex hardware programs.
• Strong experience with Siemens Xpedition (layout and library tools strongly preferred).
• Proven background designing high-speed, high-layer-count boards.
• Solid understanding of:
• Signal Integrity and Power Integrity fundamentals.
• Controlled impedance routing.
• High-density interconnects and advanced packages.
• Experience creating and maintaining EDA component libraries.
• Ability to work effectively with cross-functional teams (SI, PI, schematic, ME, manufacturing).

Preferred Qualifications:

• Experience with data-center, accelerator, networking, or HPC hardware.
• Direct involvement in memory subsystem integration and high-speed serial interfaces.
• Familiarity with SI/PI simulation workflows and constraint-driven design.
• Experience defining layer stacks in collaboration with fabricators and SI/PI teams.
• Knowledge of DFM/DFT/DFX principles for high-volume and advanced PCB manufacturing.
• Comfortable working in fast-moving, technically ambitious engineering environments.

What We Offer:

• Join an innovative team and experience company growth.
• We believe in investing in our employees and providing them with the opportunities they need to grow and develop their careers.
• Enjoy a hybrid work environment.
• We also offer flexible schedules.
• We offer remuneration that values your experience.
• The position will preferably be based in Karlsruhe (Germany).

We are looking for outstanding people willing to join our mission to change this industry and help build a better world. If you feel identified with Openchip, please contact us. We can offer a competitive compensation package in a flexible work schema that will help you keep a balance between your personal and professional life.

At Openchip & Software Technologies S.L., we believe a diverse and inclusive team is the key to groundbreaking ideas. We foster a work environment where everyone feels valued, respected, and empowered to reach their full potential – regardless of race, gender, ethnicity, sexual orientation, or gender identity.